***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Mar 22, 2019                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt 1SMB3EZ13-AU A K
.param
+vc0 = 7.372e-11	vc1 = 3.327e-12		vc2 = 2.267e-10		vc3 = 7.343e-2
+tc1 = 1.577e-2		tc2 = 1.045e-2		tc3 = 2.092e-2		tc4 = 8.531e-3
d1 A K zener
g1 K A value = {(vc0+vc1*v(K,A)^2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc2*exp(vc3*v(K,A)))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.model zener d
***** flag parameter ***
+level = 1   
***** dc model parameter ***
+ is = 4.009e-15	   n = 1.017		  rs = 1.754e-2		ikf = 1.969
+ibv = 58e-3		 nbv = 0.5		  bv = 13
***** capacitance parameter ***
+cjo = 3.034e-10	   m = 3.173e-1		  vj = 6.027e-1
+ fc = 0.5                      
***** temperature coefficient ***
+tnom = 25		  eg = 1.115		 xti = 3
+trs1 = 4.227e-4	trs2 = 2.744e-6		tbv1 = 7.265e-4		tbv2 = -4.871e-7
.ends 1SMB3EZ13-AU
*$
